SPL701 PLA Resin For Thermoforming – Heat Resistant Trays & Food Containers

Product Description

SPL701 is a medium-high optical purity PLA (L-lactide >98%, melting point ≥160°C) engineered for thermoforming processes to create heat-resistant packaging.

• Appearance: Off-white pellets; thermoformed parts are typically opaque with a smooth surface.

• Key properties: Good melt strength for even wall distribution, heat deflection suitable for warm food (up to ~90°C), and limited low-power microwave reheating (avoid high heat).

• Applications: Microwaveable lunch trays (low power only), hot fill dessert cups, takeaway clamshells, compartment plates, and bakery trays.

• Processing: Extrude sheet first, then thermoform (vacuum or pressure forming). Dry resin at 80°C for 4-6h before sheet extrusion.

• Advantage: Broader application range than SPL101; higher price but enables heat resistance.

Specifications

Packaging Method

 900kg/package · 1000 kg/ package · 25 kg/ package Vacuum aluminum foil bag