SPL701 Heat Resistant PLA Resin For Thermoforming Packaging And 3D Printing
SPL701 Heat Resistant PLA Resin For Thermoforming Packaging And 3D Printing
Place of Origin
CHINA
Brand Name
JIAOU
Product Details
Productname:
PLA Resin SPL701
Density:
1.24 G/cm³
Appearance:
Opaque Pellets
Tensilestrength:
50-70 MPa
Moisturecontent:
<0.3%
Glasstransitiontemperature:
55-60°C
Meltingpoint:
150-160°C
Elongationatbreak:
3-10%
Shelflife:
12 Months
Applications:
Thermoforming Packaging, Such As Microwave Food Containers, Hot Filling Containers,
Sample:
Available
Tensile Strength:
50-70 MPa
Moisture Content:
<0.3%
Glass Transition Temperature:
55-60°C
Melting Point:
150-160°C
Elongation At Break:
3-10%
Highlight:
Heat Resistant PLA Resin
,
PLA Resin For Thermoforming Packaging
,
PLA Resin For 3D Printing
Payment & Shipping Terms
Minimum Order Quantity
1 tons
Price
To Be Negotiated
Packaging Details
Ton bag
Delivery Time
5-20 Days
Payment Terms
L/C,T/T
Supply Ability
1000 Tons per Month
Product Description
SPL701 Heat Resistant PLA Resin – Microwave Trays & Hot Fill Containers
Product Description
SPL701 is a medium-high optical purity PLA resin with L-lactide content greater than 98%. This specialized material features a melting point of ≥160°C and is supplied as off-white pellets. It is specifically engineered for producing heat-resistant thermoformed packaging applications including microwaveable trays, hot fill cups, and lids.
Suitable for sheet extrusion, roll forming, fiber production, and 3D printing applications. While offering a lower output rate compared to SPL101, SPL701 provides broader application versatility for demanding thermal environments. Requires drying at 80°C for 4-6 hours before processing.